In 1992 Maeda et al. [270] used the FDTD method to analyze microstrip via holes. Becker et al. [271] presented FDTD computed results for both rectangular and cylindrical vias. In 1993, Harms et al. [272] utilized a non-orthogonal FDTD method to analyze cylindrical vias. Recently, Mezzanotte et al. [273] and Pillai and Wiesbeck [274] have presented further FDTD results for vias. The characterization of interconnects in integrated circuit modules has independently been studied using the FDTD method by Gribbons et al. [275], Visan et al. [276], and Yook et al. [277]. Wang [278] has recently analyzed super-conductive interconnects using the FDTD method.
In 1994, Paul [279] used the FDTD method to analyze multiconductor transmission lines. The problem of analyzing crosstalk between parallel microstrip transmission lines has been investigated using the FDTD method by Maeda et al. [280], Pothecary and Railton [281], Cerri et al. [282], and Kitamura et al. [283].