ACM/IEEE System-Level Interconnect Prediction (SLIP) 2014 Program Committee Member International Symposium on Networks-on-Chip (NOCS) 2015 Web Chair IEEE International Symposium on Quality Electronic Design (ISQED) 2016 Program Committee Member (Three Dimensional Integration & Advanced Packaging) IEEE International Symposium on Quality Electronic Design (ISQED) 2017 Program Committee Member (Three Dimensional Integration & Advanced Packaging) IEEE International Symposium on Quality Electronic Design (ISQED) 2018 Program Committee Member (Three Dimensional Integration & Advanced Packaging) IEEE International Symposium on Quality Electronic Design (ISQED) 2019 Track Co-Chair (Three Dimensional Integration & Advanced Packaging) IEEE International Symposium on Quality Electronic Design (ISQED) 2020 Track Co-Chair (Three Dimensional Integration & Advanced Packaging)
Cadence Excellence in Innovation Award 2013 Defense Advanced Research Projects Agency (DARPA) Young Faculty Award (YFA) 2016 EECS Early Career Award 2017 Voiland College Junior Faculty Research Award 2017-2018